Semiconductor Wafer Lapping and Displacement Measurement

Semiconductor Wafer Lapping and Displacement Measurement Semiconductor Semiconductor Wafer Manufacturing Displacement Description Semiconductor Wafer Lapping and Displacement Measurement This application note explains how MTI’s Accumeasure technology was used with a lapping machine to measure displacement (wafer material removal) and determine the new semiconductor wafer thickness. [...]

Capacitance Probes vs. Strain Gauges in Piezo Flexure Stages

Capacitance probes with pico-positioning sensors can be embedded in piezo flexure stages. With minor mounting modifications, these non-contact probes provide significantly greater accuracy than strain gauges. Piezo flexure stages are positioning devices with a high degree of resolution. These motion stages contain a piezoelectric actuator that converts an electrical signal into displacement based on [...]

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